China Shenzhen Wofly Technology Co., Ltd. Company News

Nowadays more and more industries need to use ultra-high purity gases, and many companies began to research and manufacture valves used to regulate high-purity gases, so there is a pressure control valve. The materials used in this regulating valve are of high quality, including the diaphragm fittings made of Hastelloy and the entire valve body made of stainless steel 316L. Continuous testing has resulted in a pressure regulator with VCR fittings for tight sealing performance, precise pressure control, precise flow control, ultra-high purity requirements, corrosion resistance, reliability and stability. Nowadays, the application range of ultra-high-purity pressure regulators is also quite wide, and its application markets are as follows Semiconductor industry: The semiconductor industry has very strict requirements for ultra-high purity gases, and ultra-high purity pressure regulators play a key role in the semiconductor manufacturing process. They are used to control and regulate the pressure of high-purity gases (such as nitrogen, hydrogen, argon, etc.) used in semiconductor manufacturing to ensure stable process conditions and optimal production quality.   Photovoltaic industry: In the photovoltaic (solar) industry, ultra-high purity pressure regulators are used to control and regulate the pressure of gases used in the manufacturing process. For example, in the manufacture of solar cells, where gases are used to clean and treat surfaces, UHP pressure regulators ensure that a constant supply of gases is provided as well as proper pressure control. Pharmaceuticals and life sciences: The demand for ultra-high purity gases is also high in the pharmaceutical and life sciences sectors. UHP pressure regulators are used in pharmaceutical processes to control and regulate the pressure of gases to ensure the safety and stability of the pharmaceutical process. In addition, they are used in laboratory equipment and for research purposes.   Laboratory and scientific research: UHP pressure regulators are widely used in laboratories and scientific research to control and regulate the pressure of gases. Whether it's in a chemistry lab, physics research or materials science, UHP pressure regulators are a key piece of equipment in ensuring the accuracy and reliability of experimental and research processes.   Ultra high purity pressure regulators are used in the semiconductor industry in a significant proportion of the many application markets. As the semiconductor manufacturing process has very strict requirements for high purity gases, ultra-high purity pressure regulators play a vital role in the semiconductor industry. In the semiconductor manufacturing process, ultra-high-purity pressure regulators are used to control and regulate the pressure of high-purity gases (e.g., nitrogen, hydrogen, argon, etc.) to ensure stable process conditions and optimal production quality. There are several reasons why ultra-high purity pressure regulators make up the largest portion of the semiconductor industry: High Purity Gas Requirements: The semiconductor manufacturing process requires extremely high purity of the gases used. Tiny impurities or contaminants can have a serious impact on the performance and reliability of semiconductor devices. Ultra-high purity pressure regulators provide a high purity gas supply, ensuring that the purity of the gas is not affected by contamination or impurities.   Process Stability and Consistency Requirements: Semiconductor manufacturing is a highly accurate and stable process where precise control of gas pressure is critical. Ultrahigh-purity pressure regulators provide stable pressure output and precise adjustment of gas pressure to ensure consistency and control of semiconductor process parameters.   Fast Response and Highly Accurate Control: Certain steps in the semiconductor manufacturing process require fast gas pressure adjustments in a short period of time, while at the same time requiring highly accurate control. Ultrahigh-purity pressure regulators meet these special requirements with fast response and high-precision control.   Reliability and safety: The semiconductor industry demands the highest levels of reliability and safety from equipment and systems. Ultrahigh-purity pressure regulators are typically manufactured with high-quality materials and advanced manufacturing processes, providing excellent reliability and safety to meet the stringent requirements of the semiconductor industry.   In summary, ultra-high purity pressure regulators are widely used in the semiconductor industry, mainly to meet the demand for high-purity gases, to provide stable process control, to ensure high accuracy and fast response, and to provide high reliability and safety requirements. These features make ultra-high purity pressure regulators an indispensable key device in the semiconductor manufacturing process. Today's market price of ultra-high-purity pressure regulator is very different from high and low, the quality of good and bad, and the need for this product, some care about the price, some care about the quality, but most of the concern is still quality and price. Our brand is AFKLOK own factory, the product also did a lot of testing finally got good results, so in the price as well as quality we have an advantage, we can replace the other brands, the future we will also get better and better.

Difference between high and low flow rates of high purity gas regulators: High flow regulators are typically designed to handle higher gas flow rates, usually in liters per minute (L/min) or cubic meters per hour (m³/h). In contrast, low flow regulators are suitable for lower gas flow ranges, usually in milliliters per minute (mL/min) or liters per hour (L/h). Design of pressure regulator valves for ultra-high purity gases： Valve Design: High flow regulators typically use larger valves and passages in order to handle larger gas flows. These valves may require larger pistons, diaphragms, or other fluid control elements to achieve precise regulation of flow. Low flow regulators, on the other hand, use smaller valves and passages to accommodate lower flow requirements.   Pressure range of ultra-high purity gas pressure regulators： High flow regulators typically have a wider pressure range and can handle higher input pressures and step down to lower output pressures. Low flow regulators may have a relatively narrow pressure range for lower input pressures and achieve a smaller output pressure range.   External Dimensions of Ultrahigh-Purity Gas Pressure Regulators： Because high flow regulators are required to handle larger gas flows, they typically have larger external dimensions and heavier weights to accommodate greater fluid dynamics. In contrast, small flow regulators can be more compact and lightweight for space-constrained or mobile applications.   Areas of application for ultra-high-purity gas pressure regulators： High flow regulators are commonly used in applications that require a high flow rate of gas supply, such as industrial process control and large laboratory equipment. Low flow regulators are used in applications requiring lower flow rates and more precise control, such as laboratory analyzers, scientific research, etc.   Principle of Operation of Ultrahigh-Purity Gas Pressure Regulators： High purity gas pressure reducers typically utilize an adjustable valve and a pressure sensor. When high pressure gas enters the pressure reducer, the valve automatically adjusts the switch to reduce the pressure to the desired output pressure based on the set pressure value.   Overall, high purity gas pressure reducers are widely used in semiconductor manufacturing, optoelectronics, photovoltaic industry, nanotechnology, laboratory research, and other areas where high purity gases are required. They are used to control gas pressure and flow to meet specific process and experimental requirements.

Tail gas treatment equipment can handle gases used in etching processes and chemical vapor deposition processes in the semiconductor, liquid crystal, and solar energy industries, including SiH4, SiH2Cl2, PH3, B2H6, TEOS, H2, CO, NF3, SF6, C2F6, WF6, NH3, N2O, and so on. Exhaust gas treatment method According to the characteristics of exhaust gas treatment, the treatment can be divided into four types of treatment: 1. Water washing type (treatment of corrosive gases) 2. Oxidizing type (dealing with combustible and toxic gases) 3. Adsorption (according to the type of adsorption material to deal with the corresponding exhaust gas). 4.Plasma combustion type (all types of exhaust gases can be treated). Each type of treatment has its own advantages and disadvantages as well as its scope of application. When the treatment method is water washing, the equipment is cheap and simple, and can only handle water-soluble gases; the application range of the electric water washing type is higher than that of the water washing type, but the operation cost is high; the dry type has good treatment efficiency, and is not applicable to the gas flow that is easy to be clogged or flowed. Chemicals and their by-products commonly used in the semiconductor industry can be categorized according to their chemical properties and their different ranges: 1. Flammable gases such as SiH4H2, etc. 2. Toxic gases such as AsH3, PH3, etc. 3. Corrosive gases such as HF, HCl, etc. 4. Greenhouse gases such as CF4, NF3, etc. Since the above four gases are harmful to the environment or human body, must prevent its direct emission into the atmosphere, so the general semiconductor plant are installed with a large centralized exhaust gas treatment system, but this system is only water scrubbing exhaust, so its application is limited to the long-distance water-soluble gases, and can not deal with the ever-changing and subtle division of the semiconductor process exhaust gas. Therefore, it is necessary to select and match the corresponding exhaust gas treatment equipment according to the gas characteristics derived from each process in order to solve the exhaust gas problem in a small way. As the working area is mostly away from the central exhaust gas treatment system, often due to gas characteristics lead to crystallization or dust accumulation in the pipeline, resulting in clogging of the pipeline leading to gas leakage, and in serious cases, even cause an explosion, can not ensure that the site staff's work safety. Therefore, in the work area need to configure a small exhaust gas treatment equipment suitable for the characteristics of the process gas, in order to reduce the stagnant exhaust gas in the work area, to ensure the safety of personnel.

There are a wide variety of gases found within a pharmaceutical or medical laboratory. Many have no taste, colour or smell, which makes it difficult to tell if a gas leak is present. A gas leak from a cylinder or fixed pipe gas system poses a series risk that can cause a potentially fatal incident or hazard within a laboratory environment.   The pharmaceutical industry is one of the world’s fastest growing industries. Most of the sales revenue it generates is then reinvested in the area of research and development of new products. Research and development uses a wide range of speciality gases and equipment. Analytic instruments such as gas chromatographs, liquid chromatographs and spectrometers all rely on the appropriate level of gas delivery to operate effectively.   These pharmaceutical and medical gases are manufactured specifically for the medical, pharmaceutical manufacturing, and biotechnology industries. They are frequently used to synthesize, sterilize, or insulate processes or products which contribute to human health.   Pharmaceutical gases are also inhaled by patients in a technique known as gas therapy. Gases used for human healthcare are strictly controlled by both legislation and industrial standards so as to not impair human physiology.   Gases found within a laboratory Helium Helium (He) is a very light, odourless and tasteless gas. It is also one of the 6 noble gases (helium, neon, argon, krypton, xenon and radon), so called because they do not react with other elements and therefore cannot bond with other atoms to form complex compounds. This gives it a strong safety profile and a potential usage in multiple applications. Due to their unreactive status Helium is often used as a carrier gas in laboratories. Helium has many uses beyond its most common one to fill balloons and its role within the pharmaceutical and biotechnology sector is invaluable. It is most widely used in the laboratory in the cooling of magnets inside MRI machines however it is also used across a large range of medical areas including respiratory, cardiology, radiology and cryology functions.   Argon Argon (Ar) is also a noble gas with non-reactive properties. In addition to its well-known use in neon lights it is also sometimes used in the medical and biotechnology sectors. It is the preferred inert gas for use within Schlenk lines and glove boxes in cases where nitrogen may react with reagents or apparatus and can also be uses is the carrier gas in gas chromatography and electrospray mass spectrometry. In pharmaceuticals and medicine it can also be used in packaging where nitrogen may conflict and also in cryosurgery and in lasers used for vascular welding and correcting eye defects.   Nitrogen Although not a noble gas like Helium or Argon Nitrogen (N) is also commonly used in pharmaceutical industry due to is relatively non- reactive properties in many different processes and applications. Laboratories primarily to control the atmosphere for highly sensitive equipment and procedures. Nitrogen gas is applied to control oxygen levels, humidity, and temperature in lab equipment including cell incubators, dry boxes, glove boxes, and mass spectrometers.

1. What gases the VCR gas pressure regulator is suitable for？ VCR gas pressure regulators are suitable for hazardous and ultra-high purity gases.   2. What are the hazardous gases for which the VCR gas pressure regulator is suitable? Common dangerous gases and related information are: Ammonia (NH3): Ammonia is a common chemical widely used in agricultural fertilizers, refrigerants, cleaning agents and industrial processes. Chlorine (Cl2): Chlorine is a commonly used chemical for disinfection, bleaching, water treatment and the manufacture of other chemicals. Carbon dioxide (CO2): Carbon dioxide is a common gas used as a carbonating agent in the food and beverage industry, as well as in welding, firefighting and other industrial applications. Hydrogen Cyanide (HCN): Hydrogen cyanide is a highly toxic gas used in metallurgy, organic synthesis and pesticide manufacturing. Hydrogen Sulfide (H2S): Hydrogen sulfide is a highly malodorous and toxic gas commonly used in the oil and gas industry and other industrial processes. Hydrogen Chloride (HCl): Hydrogen Chloride is a gas with an irritating odor and is commonly used in the manufacture of chemicals, cleaning metals, and regulating pH levels. Nitrogen (N2): Nitrogen is an inert gas commonly used to protect and inert reaction environments, as well as for gas containment and pressure testing. Oxygen (O2): Oxygen is an essential gas commonly used in the medical industry, gas cutting, welding and combustion processes.   3. Characteristics of VCR gas pressure regulator？ HIGH ACCURACY REGULATION: The VCR Gas Pressure Regulator utilizes a precise regulation mechanism that provides highly accurate gas pressure regulation. This makes it useful in applications where accurate control of gas flow and pressure is required, such as in laboratory research, precision manufacturing and gas analysis. Reliability and Stability: Designed for long-term stable gas regulation, VCR gas pressure regulators are capable of providing reliable performance under varying operating conditions. They are typically constructed using high quality materials and workmanship to ensure reliable operation over long periods of time and to minimize the risk of leakage and failure. Multiple Connection Options: VCR gas pressure regulators are typically available with a variety of connection options to accommodate different gas piping and system requirements. Common connection options include VCR metal-sealed fittings, flanged connections, and threaded connections, making the installation and integration of the regulator flexible and easy. Wide range of adjustability: VCR gas pressure regulators typically have a wide range of adjustability to accommodate different pressure requirements. Whether high or low pressure regulation is required, they provide the appropriate solution. Safety features: VCR gas pressure regulators are often equipped with a variety of safety features to ensure the safe operation of the system. These features may include over-pressure protection, over-current protection, over-temperature protection and leak detection to minimize the risk of potential hazards and accidents. Adjustability: VCR gas pressure regulators are typically adjustable, allowing the user to set and adjust the pressure to specific needs. This adjustability makes the regulator suitable for different application scenarios and process requirements.   4. The environment in which the VCR gas pressure regulator is assembled？ VCR gas pressure regulators are assembled in clean rooms to ensure cleanliness and to help maintain the integrity and performance of the VCR gas pressure regulator.   5. How VCR Gas Pressure Regulators Work? Gas Inlet to Regulator: Gas enters the VCR gas pressure regulator through a connecting line. The inlet is usually connected to a gas source. Pressure Sensing: Inside the regulator there is a pressure sensing element, usually a spring or a diaphragm. As the gas enters the regulator, the pressure sensing element is subjected to the gas pressure and generates a corresponding force. Balancing of Forces: The force of the pressure sensing element is balanced against a regulating mechanism inside the regulator. This mechanism usually consists of a regulating valve and spool. Regulating Valve Operation: Depending on the force of the pressure sensing element, the regulating valve will open or close accordingly to adjust the pressure of the gas flowing through the system. When the force of the pressure sensing element increases, the regulating valve closes, decreasing the gas flow and thus lowering the system pressure. Conversely, when the force on the pressure sensing element decreases, the regulating valve opens, increasing the gas flow and raising the system pressure. Pressure Stabilization: By continually adjusting the valve opening, the VCR Gas Pressure Regulator maintains a steady pressure of gas flowing through the system. The regulator will adjust in real time as needed to ensure that the gas pressure in the system remains within a predetermined range.

In semiconductor fabrication, gases do all the work and lasers get all the attention. While lasers do etch transistor patterns into silicon, the etch that first deposits the silicon and breaks down the laser to make complete circuits is a series of gases. It is not surprising that these gases, which are used to develop microprocessors through a multi-stage process, are of high purity. In addition to this limitation, many of them have other concerns and limitations. Some of the gases are cryogenic, others are corrosive, and still others are highly toxic.   All in all, these limitations make manufacturing gas distribution systems for the semiconductor industry a considerable challenge. Material specifications are demanding. In addition to material specifications, a gas distribution array is a complex electromechanical array of interconnected systems. The environments in which they are assembled are complex and overlapping. Final fabrication takes place on site as part of the installation process. Orbital welding helps to meet the high specification gas distribution requirements while making fabrication in tight and challenging environments more manageable.   How gases are used in the semiconductor industry   Before attempting to plan the manufacture of a gas distribution system, it is necessary to understand at least the basics of semiconductor manufacturing. At its core, semiconductors use gases to deposit near-elemental solids on a surface in a highly controlled manner. These deposited solids are then modified by introducing additional gases, lasers, chemical etchants, and heat. The steps in the broad process are:   Deposition: This is the process of creating the initial silicon wafer. Silicon precursor gases are pumped into a vacuum deposition chamber and form thin silicon wafers through chemical or physical interactions.   Photolithography: The photo section refers to lasers. In the higher extreme ultraviolet lithography (EUV) spectrum used to make the highest specification chips, a carbon dioxide laser is used to etch the microprocessor circuitry into the wafer.   Etching: During the etching process, halogen-carbon gas is pumped into the chamber to activate and dissolve selected materials in the silicon substrate. This process effectively engraves the laser-printed circuitry onto the substrate.   Doping: This is an additional step that changes the conductivity of the etched surface to determine the exact conditions under which the semiconductor conducts.   Annealing: In this process, reactions between wafer layers are triggered by elevated pressure and temperature. Essentially, it finalizes the results of the previous process and creates the finalized processor in the wafer.   Chamber and Line Cleaning: The gases used in the previous steps, especially etching and doping, are often highly toxic and reactive. Therefore, the process chamber and the gas lines feeding it need to be filled with neutralizing gases to reduce or eliminate harmful reactions, and then filled with inert gases to prevent the intrusion of any contaminating gases from the outside environment.   Gas distribution systems in the semiconductor industry are often complex because of the many different gases involved and the tight control of gas flow, temperature and pressure that must be maintained over time. This is further complicated by the ultra-high purity required for each gas in the process. The gases used in the previous step must be flushed out of the lines and chambers or otherwise neutralized before the next step of the process can begin. This means that there are a large number of specialized lines, interfaces between welded tube systems and hoses, interfaces between hoses and tubes and gas regulators and sensors, as well as interfaces between all of the previously mentioned components and valves and sealing systems designed to prevent pipeline contamination of the natural gas supply from being swapped out.   In addition, cleanroom exterior and specialty gases will be equipped with bulk gas supply systems in cleanroom environments and specialized confined areas to mitigate any hazards in the event of accidental leakage. Welding these gas systems in such a complex environment is no easy task. However, with care, attention to detail and the right equipment, this task can be accomplished successfully.   Manufacturing gas distribution systems in the semiconductor industry Materials used in semiconductor gas distribution systems are highly variable. They can include things like PTFE-lined metal pipes and hoses to resist highly corrosive gases. The most common material used for general purpose piping in the semiconductor industry is 316L stainless steel - a low carbon stainless steel variant. When it comes to 316L versus 316, 316L is more resistant to intergranular corrosion. This is an important consideration when dealing with a range of highly reactive and potentially volatile gases that can corrode carbon. Welding 316L stainless steel releases less carbon precipitates. It also reduces the potential for grain boundary erosion, which can lead to pitting corrosion in welds and heat affected zones.   To reduce the possibility of piping corrosion leading to product line corrosion and contamination, 316L stainless steel welded with pure argon shielding gas and tungsten gas shielded weld rails is the standard in the semiconductor industry. The only welding process that provides the control needed to maintain a high purity environment in process piping. Automated orbital welding provides only the repeatable process control needed to complete the weld in the fabrication of semiconductor gas distribution systems. The fact that enclosed orbital weld heads can accommodate the crowded and difficult spaces at complex intersections between process areas is a significant advantage of the process. Shenzhen Wofei Technology Co., Ltd, with over 10 years of experience in the supply of industrial and specialty gases, materials, gas supply systems and gas engineering for the semiconductor, LED, DRAM, and TFT-LCD markets, we can provide you with the materials necessary to bring your products to the forefront of the industry. We can not only provide a wide range of valves and fittings for semi-conductor electronic specialty gases, but also design gas piping and equipment installation for our customers.

pneumatic diaphragm valve is a type of valve that uses compressed air to actuate a flexible diaphragm to control the flow of fluids or gases. The valve consists of a body, a diaphragm, and a pneumatic actuator that controls the movement of the diaphragm. The working principle of pneumatic diaphragm valve： （1）Air supply: Compressed air is supplied to the pneumatic actuator of the valve, which is connected to the diaphragm. （2）Diaphragm movement: The pneumatic actuator moves the diaphragm up or down, depending on the direction of the air flow. This movement opens or closes the valve, allowing or restricting the flow of fluid or gas through the valve. （3）Control signal: The pneumatic actuator is controlled by a signal from an external controller or control system, which regulates the amount of air supplied to the actuator and thus controls the position of the diaphragm. （4）Flow control: By adjusting the position of the diaphragm, the pneumatic diaphragm valve can control the flow of fluid or gas through the valve. When the diaphragm is in the open position, the fluid or gas flows through the valve, and when the diaphragm is in the closed position, the flow is restricted or stopped.   Pneumatic diaphragm valves are commonly used in a variety of applications, including chemical processing, pharmaceuticals, food and beverage, and water treatment, where reliable and efficient flow control is critical. They are known for their reliability, durability, and ease of maintenance.

Pressure is one of the important parameters in industrial production. Correct measurement and control of pressure is an important link to ensure the good operation of the production process and to realize high-quality, high-yield, low-consumption and safe production. Therefore, the detection of pressure is getting more and more attention. 1. what is the electric contact pressure gauge？ The electric contact pressure gauge is one of the most frequently contacted pressure gauges by the grassroots calibrators because of its variety, complete models and wide range of applications. The general accuracy level is 1.0-4.0, especially in the measurement and control of boilers, pressure vessels or pressure pipelines. Usually the pressure gauge is used in conjunction with the corresponding relays, contactors and other electrical devices to realize the automatic control of the measured pressure system and the purpose of signal alarm. In the course of daily use, pressure gauges will have various problems and malfunctions due to vibration, oil, wear and corrosion, etc., which require timely maintenance and calibration.   Working principle of electric contact pressure gauge？ The electric contact pressure gauge consists of a spring tube pressure gauge equipped with an electric contact. In addition to on-site indication, it is also used to signal pressure exceeding limits. The principle of pressure measurement is based on the measuring system in the spring tube under the pressure of the measured medium to force the end of the spring tube to produce the corresponding elastic deformation (displacement), through the fixed gear on the pointer will be the measured value of the indication in the dial; at the same time, drive the contact to produce the corresponding action (closed or open), so that the voltage control system in the circuit on or off, so as to achieve the purpose of the automatic control alarm and on-site instructions.   3. Calibration of electric contact pressure gauge？ The electric contact pressure gauge is actually a circuit switch operated by the pressure gauge. It is just an ordinary spring tube pressure gauge, retrofitted with electric contact signaling device. The calibration of the pressurized part is the same as that of the ordinary pressure gauge. The difference with the other pressure gauge is the reaction after connection. When verifying, first look at the accuracy of its pressure, and then look at the sensitivity of its connection reaction. Therefore, the verification is divided into two steps: (1) Pressurized part of the general-purpose pressure gauge calibration value; (2) The electrical part, after the demonstration value calibration is qualified, the electric contact signaling device should be calibrated under pressure and its connection performance should be checked with a multimeter.   4. Calibration of the pressurized part of the electric contact pressure gauge？ Comparison method is a common method to calibrate the pressure gauge. The standard pressure gauge and the measured pressure gauge are installed on the same level of the piston pressure gauge or pressure calibrator. After the piston is filled with working fluid (transformer oil) and the internal air is discharged, the needle valve on the oil cup is closed to form a closed system; the pressure of the extruded working fluid can be changed by rotating the handwheel on the piston of the piston type pressure gauge or calibrator. Hydraulic drive of the working fluid, so that the same level of standard pressure gauge and the pressure gauge to be measured pressure synchronization and equal changes; the standard pressure gauge and the pressure gauge to be measured to compare the indicated value.  

The production process of electronic specialty gases includes several processes such as synthesis, purification, filling, analysis and testing, mixing and proportioning. In order to meet the downstream semiconductor manufacturing requirements for purity and impurity content, the purification process is very important. Depending on the composition of the upstream synthesis gas or raw gas, low temperature distillation or multi-stage purification is performed.   High cleanliness requirements The preparation process of electronic special gases can be divided into two major blocks of upstream synthesis preparation and purification, which belongs to the chemical production process. The size of the production pipeline is large, and there is no special cleanliness level requirement. After downstream purification, the product is filled with gas and mixed for preparation. The production pipeline is small and has cleanliness level requirements. It needs to meet the standard specification of semiconductor manufacturing process. High sealing requirements Due to their chemical activity, electronic specialty gases also place high demands on the materials and sealing of the production process system. Just like the requirements of semiconductor manufacturing, it prevents interface leakage caused by the introduction of impurities or corrosion of special gases. The system can also be used to prevent the introduction of impurities or the leakage of interface caused by the corrosion of special gases.   High quality stability requirements The quality of electronic specialty gases includes a number of indicators such as purity and impurity particle content. Any change in the indicators will affect the results of the downstream semiconductor manufacturing process. Therefore, in order to ensure the consistency of the electronic special gas product indicators, the preparation process system to control the stability of the indicators is also very important.     Due to the chemical activity and quality requirements of EGP, the production system for EGP preparation, especially the downstream purification system, must meet the requirements of high purity materials, high sealing, high cleanliness and high quality consistency, and the construction of engineered components must meet the standards of the semiconductor manufacturing industry. What we commonly refer to as "high purity" is theoretically the definition of the purity of a substance, such as high purity gases, high purity chemicals, etc. Process systems or process system components that are applied to high-purity substances are also referred to as high-purity, such as high-purity systems and high-purity valves. Electronic specialty gas preparation systems require high purity application fittings, valves, and other fluid components, i.e., fittings and valves that are processed with high purity materials and clean manufacturing processes, and are structured for easy purging and cleaning. With high sealing performance. These fluid components are designed to meet the process flow path of the application, using the engineering and construction requirements of the semiconductor industry.   High Purity Piping Connections VCR metal gasket face seal connections and automatic guide butt weld connections are widely used in demanding fluid system purity process requirements due to the ability to meet both smooth transition of the flow path at the connection, no stagnation zone, and high sealing performance.VCR connections form a narrow surface seal by extruding a relatively soft metal gasket. Repeatable and consistent connection and sealing performance is assured each time the deformed gasket is removed and replaced.   Tubes are welded using an automatic orbital welding system. The tube is protected by high purity gas inside and out. The tungsten electrode rotates along the orbit for high quality welding. Fully automated orbital welding melts the pipe without introducing other materials, achieving a high quality weld by repeatedly controlling thin-walled pipe is difficult to achieve with manual welding.   VCR Metal Gasket Face Seal Connection   Automatic Orbital Butt Welding Connection of Pipes   High Purity Valves The chemical activity of flammable, explosive, corrosive, and toxic electronic specialty gases places high demands on the sealing of the valve. In order to improve the sealing reliability, the requirement of packingless valves to prevent external leakage, that is, switching operation of the valve stem and the valve body between the seal using metal bellows or metal diaphragm, in order to eliminate leakage due to abrasion and packing seal deformation. Bellows-sealed and diaphragm-sealed valves are commonly used in process systems for high-purity applications because of the greater reliability of the seals and the easier cleaning and purge replacement of the valve internals.   Bellows-sealed valves are a packingless needle valve construction that allows for slow opening and flow regulation. Used for electronic specialty gas filling with safety flow requirements or on precursor source bottles with high safety requirements. The all-metal stem tip seals allow for extremely low operating temperatures and are used for cryogenic liquefaction of electronic specialty gases in finished product tanks after cryogenic distillation for piping.   Springless Diaphragm Seal Valve is a 1/4" snap-open valve for use as an automatically controlled switching valve in delivery piping. They are commonly used in ultra-high-pressure, high-purity applications due to their simple internal flow path, small internal volume, and ease of purging and replacement.   Diaphragm-sealed valves that close via the stem tip can open slowly and be used at higher operating pressures than non-sprung diaphragm-sealed valves. They are widely used on high-pressure electronic specialty gas filling or precursor source bottles.   The secondary seal bellows valve can not only be used in ultra-low temperature process systems at -200 degrees, but also prevents leakage of hazardous media into the atmosphere. Usually used for very dangerous electronic special gases, such as silane filling system.   Shenzhen Wofei Technology Co., Ltd, with over 10 years of experience in the supply of industrial and specialty gases, materials, gas supply systems and gas engineering for the semiconductor, LED, DRAM, TFT-LCD markets, we can provide you with the necessary materials to push your products to the forefront of the industry. We can not only supply a wide range of valves and fittings for semi-conductor electronic specialty gases, but we can also design gas piping and equipment installation for our customers. If you have any needs in this area, please contact us at 0927023443.  

Specialty gases are often considered the lifeblood of the electronics industry and the heart of semiconductor manufacturing. The global specialty gases market is used in four key applications in the semiconductor chip manufacturing process and is directly related to the availability and potential of the technologies we use today. However, the use of gas is inevitably the need for related accessories and equipment for further processing in order to be well used; therefore, Shenzhen Wofly Technology as a gas pipeline porter, which is clearly the main battlefield of Wofly Technology, sweeping the domestic countless laboratory projects has been very mature, like Huawei Fortune 500 companies, but also have cooperated with the semiconductor project needs to provide services or products. For the semiconductor project needs to provide services or products Wofly Technology is also the biggest help it can provide, Wofly Technology's special gas certificates, as well as research and development of special gas equipment (special gas cabinet) GC, (special gas rack) GR, (valve box) VMB, (valve plate) VMP; gas mixing and proportioning device has a fully automated mixed-gas proportional cabinet, horizontal mixed-gas proportional cabinet, the two elements of the gas mixing and proportioning device, multi-distant gas mixing and proportioning device, and so on. All these can provide the greatest help for the semiconductor industry. Wolfly technology to sell products are matched with the gas, they can be equipped with a complete set of gas supply equipment, after all, engineering is their advantage, in this than many companies to be much better, it is understood that a large part of the company is only to buy products, Wolfly technology both products, and engineering and in this road has been walking for 12 years, can be said to be a wealth of experience. Although, now the Wolfly technology is not counted as one of the companies, but in the country or a small reputation, I believe that one day in the future in this industry will be a small international success, after all, the quality of the product can prove everything.

In semiconductor fabrication, gases do all the work and lasers get all the attention. While lasers do etch transistor patterns into silicon, the etch that first deposits the silicon and breaks down the laser to make complete circuits is a series of gases. It is not surprising that these gases, which are used to develop microprocessors through a multi-stage process, are of high purity. In addition to this limitation, many of them have other concerns and limitations. Some of the gases are cryogenic, others are corrosive, and still others are highly toxic. All in all, these limitations make manufacturing gas distribution systems for the semiconductor industry a considerable challenge. Material specifications are demanding. In addition to material specifications, a gas distribution array is a complex electromechanical array of interconnected systems. The environments in which they are assembled are complex and overlapping. Final fabrication takes place on site as part of the installation process. Orbital soldering helps meet the high specifications of gas distribution requirements while making manufacturing in tight, challenging environments more manageable.   How the semiconductor industry uses gases Before attempting to plan the manufacture of a gas distribution system, it is necessary to understand at least the basics of semiconductor manufacturing. At its core, semiconductors use gases to deposit near-elemental solids on a surface in a highly controlled manner. These deposited solids are then modified by introducing additional gases, lasers, chemical etchants, and heat. The steps in the broad process are: Deposition: This is the process of creating the initial silicon wafer. Silicon precursor gases are pumped into a vacuum deposition chamber and form thin silicon wafers through chemical or physical interactions. Photolithography: The photo section refers to lasers. In the higher extreme ultraviolet lithography (EUV) spectrum used to make the highest specification chips, a carbon dioxide laser is used to etch the microprocessor circuitry into the wafer. Etching: During the etching process, halogen-carbon gas is pumped into the chamber to activate and dissolve selected materials in the silicon substrate. This process effectively engraves the laser-printed circuitry onto the substrate. Doping: This is an additional step that changes the conductivity of the etched surface to determine the exact conditions under which the semiconductor conducts. Annealing: In this process, reactions between wafer layers are triggered by elevated pressure and temperature. Essentially, it finalizes the results of the previous process and creates the finalized processor in the wafer. Chamber and Line Cleaning: The gases used in the previous steps, especially etching and doping, are often highly toxic and reactive. Therefore, the process chamber and the gas lines feeding it need to be filled with neutralizing gases to reduce or eliminate harmful reactions, and then filled with inert gases to prevent the intrusion of any contaminating gases from the outside environment. Gas distribution systems in the semiconductor industry are often complex because of the many different gases involved and the tight control of gas flow, temperature and pressure that must be maintained over time. This is further complicated by the ultra-high purity required for each gas in the process. The gases used in the previous step must be flushed out of the lines and chambers or otherwise neutralized before the next step of the process can begin. This means that there are a large number of specialized lines, interfaces between the welded tube system and the hoses, interfaces between the hoses and tubes and the gas regulators and sensors, and interfaces between all of the previously mentioned components and the valves and sealing systems designed to prevent pipeline contamination of the natural gas supply from being swapped out. In addition, cleanroom exteriors and specialty gases will be equipped with bulk gas supply systems in cleanroom environments and specialized confined areas to mitigate any hazards in the event of accidental leakage. Welding these gas systems in such a complex environment is no easy task. However, with care, attention to detail and the right equipment, this task can be accomplished successfully.   Manufacturing gas distribution systems in the semiconductor industry The materials used in semiconductor gas distribution systems are highly variable. They can include things like PTFE-lined metal pipes and hoses to resist highly corrosive gases. The most common material used for general purpose piping in the semiconductor industry is 316L stainless steel - a low carbon stainless steel variant. When it comes to 316L versus 316, 316L is more resistant to intergranular corrosion. This is an important consideration when dealing with a range of highly reactive and potentially volatile gases that can corrode carbon. Welding 316L stainless steel releases less carbon precipitates. It also reduces the potential for grain boundary erosion, which can lead to pitting corrosion in welds and heat affected zones. To reduce the possibility of piping corrosion leading to product line corrosion and contamination, 316L stainless steel welded with pure argon shielding gas and tungsten gas shielded weld rails is the standard in the semiconductor industry. The only welding process that provides the control needed to maintain a high purity environment in process piping. Automated orbital welding is only available in semiconductor gas distribution

Due to its inert nature, gaseous nitrogen can be used in a variety of purging, covering and flushing operations. Depending on the type of process involved, different levels of nitrogen purity are required to meet unique manufacturing needs.   What is Nitrogen Purity?   Nitrogen purity is the percentage of nitrogen present in a sample taken from its stream compared to the impurities present. Nitrogen can be classified as high or low purity based on the ratio of pure gas to contaminants such as oxygen, water vapor, carbon monoxide and carbon dioxide.   This classification based on nitrogen concentration plays a key role in determining the suitability of nitrogen for any industrial process.   High Purity vs. Low Purity Nitrogen   The purity of a nitrogen sample is determined by the percentage/concentration of pure nitrogen in it. For a gas to be categorized as high purity, it must contain at least 99.998% nitrogen, whereas lower purity nitrogen typically contains a higher percentage of impurities. High Purity Nitrogen   Gaseous nitrogen with a concentration above 99.998% is considered a high purity fraction. High purity nitrogen can be graded in different ways by different manufacturers, but they are mostly considered "zero grade" fractions. Zero-grade high-purity nitrogen is categorized as such because they contain hydrocarbon impurities of less than 0.5 parts per million.   Other key characteristics of high purity nitrogen are:   Oxygen concentration ≤ 0.5 ppm   Carbon monoxide/carbon dioxide not more than 1.0 ppm   Moisture not greater than 3 ppm   Low purity nitrogen   Nitrogen with a purity of 90% to slightly less than 99.9% is considered low purity.   Nitrogen Purity Classification   The classification of pure nitrogen is accomplished through a grading system using numbers within each lowest purity grade. The first number of each grade refers to the number of "nines" that appear within it, while the second number represents the number after the last nine digits.   Purity grades of nitrogen are categorized as N2.0, N3.0, N4.0, N5.0, N6.0, and N7.0.   What is ultra-high purity nitrogen?   Ultrahigh-purity nitrogen is nitrogen with a concentration of 99.999% and negligible impurities. Nitrogen specifications are stringent and variations invalidate the classification.   The gas must not contain more than two parts per million by volume (ppmv) of oxygen, 0.5 parts per million by volume of total hydrocarbons, and one part per million by volume of moisture). Nitrogen is commonly used for scientific applications.   What is oxygen-free nitrogen?   Oxygen free nitrogen (OFN) is defined as gaseous nitrogen containing no more than 0.5 parts per million (ppm) of oxygen. OFN gases are typically maintained at 99.998% purity. This grade of nitrogen is used in scientific research and calibration processes where oxygen impurities may alter results or cause incorrect results. Nitrogen Purity Levels by Industry/Application   As mentioned above, the concentration of nitrogen required for different industrial processes varies greatly. The key consideration in selecting a nitrogen grade is the effect of impurities on the chosen application. Sensitivity to moisture, oxygen and other contaminants are key factors to consider.   Food Grade Nitrogen / Beverage Grade Nitrogen   Nitrogen is commonly used in different steps of food/beverage production, packaging and storage. Nitrogen in food packaging and processing is used to maintain the shelf life of processed foods/beverages by eliminating food oxidants, preserving flavor and preventing rancidity. The purity required for food grade nitrogen is typically in the range of 98-99.5%.   Pharmaceutical Grade Nitrogen   Pharmaceutical manufacturing processes require high purity to prevent contamination and alteration of the final product. Many pharmaceuticals require high grade nitrogen with purities between 97-99.99%. This high to ultra-high purity nitrogen is used to cover nitrogen tanks, containers and other drug manufacturing equipment.   High purity nitrogen is also used in pharmaceutical packaging to help maintain freshness and prevent deterioration of active ingredients.   Gaseous nitrogen with 95-99% purity is used in the oil and gas industry to reduce the risk of fire and explosion during the process. Inerting chemical storage tanks and purging pipelines with gaseous nitrogen helps minimize the risk of sudden combustion of their contents.   Pipeline maintenance services often use pressurized nitrogen for pipeline cleaning and pipeline decommissioning processes.   Industrial Nitrogen Grade Purity   Some industrial applications and their nitrogen grade requirements are outlined below.   Electronics and Semiconductor Manufacturing Grade Nitrogen   Typical nitrogen content requirements in electronics and semiconductor manufacturing are usually at least 99.99-99.999%. Some processes such as parts cleaning and adhesive coverage use lower concentrations of nitrogen (95-99.5%).   Plastics Manufacturing Grade Nitrogen   Nitrogen grade requirements for plastics synthesis are 95-98% for injection molding, 99.5% for gas-assisted injection molding, and 98-99.5% for blown film extrusion.   Metal processing grade nitrogen   The nitrogen content of metal processing grade varies greatly, from 95-99% for heat treatment to 99-99.999% for laser cutting process.   Power generation grade nitrogen   Nitrogen in the 95-99.6% range is required for power generation processes such as air seal blowdown, boiler lining, natural gas pipeline blowdown and water softening overlay.